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	<title>PRESSEMITTEILUNGEN &#187; Measurement Systems</title>
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		<title>New Fluorescence Lifetime Spectroscopy System &#8211; the C10627 Streakscope</title>
		<link>http://www.blogspan.net/presse/new-fluorescence-lifetime-spectroscopy-system-the-c10627-streakscope/mitteilung/121091/</link>
		<comments>http://www.blogspan.net/presse/new-fluorescence-lifetime-spectroscopy-system-the-c10627-streakscope/mitteilung/121091/#comments</comments>
		<pubDate>Thu, 22 Oct 2009 08:30:36 +0000</pubDate>
		<dc:creator>News Online</dc:creator>
				<category><![CDATA[Allgemeine Mitteilungen]]></category>
		<category><![CDATA[Ammersee]]></category>
		<category><![CDATA[Dynamic Range]]></category>
		<category><![CDATA[Fluorescence Spectroscopy]]></category>
		<category><![CDATA[Hamamatsu]]></category>
		<category><![CDATA[Herrsching]]></category>
		<category><![CDATA[Light Sources]]></category>
		<category><![CDATA[Measurement Method]]></category>
		<category><![CDATA[Measurement Systems]]></category>
		<category><![CDATA[Measurement Times]]></category>
		<category><![CDATA[Order Of Magnitude]]></category>
		<category><![CDATA[Photon Counting]]></category>
		<category><![CDATA[Photons]]></category>
		<category><![CDATA[Pmt]]></category>
		<category><![CDATA[Ps Domain]]></category>
		<category><![CDATA[Repetition Rate]]></category>
		<category><![CDATA[Spectroscopy System]]></category>
		<category><![CDATA[Streak Technology]]></category>
		<category><![CDATA[Temporal Resolution]]></category>
		<category><![CDATA[Time Resolved Fluorescence]]></category>

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		<description><![CDATA[(pressebox) Herrsching am Ammersee, 22.10.2009, Since many years the streak technology is well established as the high-end method for time-resolved fluorescence spectroscopy. It is employed in a range of complete measurement systems Hamamatsu is offering. Other well-known methods in this field are time-correlated single photon counting (TCSPC) using a PMT or MCP-PMT as a detector, [...]]]></description>
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		<title>ADLINK Technology Expands Its GPIB Family with New USB-GPIB Interface Product, USB-3488A</title>
		<link>http://www.blogspan.net/presse/adlink-technology-expands-its-gpib-family-with-new-usb-gpib-interface-product-usb-3488a/mitteilung/90393/</link>
		<comments>http://www.blogspan.net/presse/adlink-technology-expands-its-gpib-family-with-new-usb-gpib-interface-product-usb-3488a/mitteilung/90393/#comments</comments>
		<pubDate>Wed, 08 Jul 2009 07:46:08 +0000</pubDate>
		<dc:creator>News Online</dc:creator>
				<category><![CDATA[Allgemeine Mitteilungen]]></category>
		<category><![CDATA[Adlink Technology]]></category>
		<category><![CDATA[Automation Product]]></category>
		<category><![CDATA[Bus Controller]]></category>
		<category><![CDATA[Compatible Bus]]></category>
		<category><![CDATA[Control Capability]]></category>
		<category><![CDATA[Control Thousands]]></category>
		<category><![CDATA[Global Provider]]></category>
		<category><![CDATA[Gpib Bus]]></category>
		<category><![CDATA[Gpib Controller]]></category>
		<category><![CDATA[Gpib Interface]]></category>
		<category><![CDATA[Interface Cards]]></category>
		<category><![CDATA[Interface Product]]></category>
		<category><![CDATA[Measurement Applications]]></category>
		<category><![CDATA[Measurement Systems]]></category>
		<category><![CDATA[Pci Interface]]></category>
		<category><![CDATA[Product Segment]]></category>
		<category><![CDATA[Pxi]]></category>
		<category><![CDATA[Taiex]]></category>
		<category><![CDATA[Usb Interface Controller]]></category>
		<category><![CDATA[Vibration Tests]]></category>

		<guid isPermaLink="false">http://www.blogspan.net/presse/adlink-technology-expands-its-gpib-family-with-new-usb-gpib-interface-product-usb-3488a/mitteilung/90393/</guid>
		<description><![CDATA[(pressebox) Duesseldorf, 08.07.2009, ADLINK Technology Inc. (TAIEX:6166), a global provider of PC-based test and measurement systems and modules, announced the release of the USB-3488A, a cost-effective IEEE-488 GPIB to USB interface controller. The USB-3488A is fully IEEE 488.1 and IEEE 488.2 compatible and provides the benefits of &#34;plug-and-play&#34; USB connection for simple direct connection of GPIB [...]]]></description>
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		<title>Düsen-Schlick technologies is exhibiting at the Achema 2009</title>
		<link>http://www.blogspan.net/presse/dusen-schlick-technologies-is-exhibiting-at-the-achema-2009/mitteilung/65418/</link>
		<comments>http://www.blogspan.net/presse/dusen-schlick-technologies-is-exhibiting-at-the-achema-2009/mitteilung/65418/#comments</comments>
		<pubDate>Tue, 28 Apr 2009 12:00:21 +0000</pubDate>
		<dc:creator>News Online</dc:creator>
				<category><![CDATA[Allgemeine Mitteilungen]]></category>
		<category><![CDATA[100 Years]]></category>
		<category><![CDATA[Abc Technology]]></category>
		<category><![CDATA[Achema]]></category>
		<category><![CDATA[Atomisation]]></category>
		<category><![CDATA[Continuous Quality]]></category>
		<category><![CDATA[Cost Effectiveness]]></category>
		<category><![CDATA[DüSen Schlick]]></category>
		<category><![CDATA[Endurance Tests]]></category>
		<category><![CDATA[Iso 9001 2000]]></category>
		<category><![CDATA[Measurement Services]]></category>
		<category><![CDATA[Measurement Systems]]></category>
		<category><![CDATA[Nozzle Manufacturers]]></category>
		<category><![CDATA[Nozzles]]></category>
		<category><![CDATA[Plant Construction]]></category>
		<category><![CDATA[Quality Management System]]></category>
		<category><![CDATA[Quality Standards]]></category>
		<category><![CDATA[Spray Technology]]></category>
		<category><![CDATA[Technical Knowledge]]></category>
		<category><![CDATA[Test Centre]]></category>
		<category><![CDATA[Vertical Integration]]></category>

		<guid isPermaLink="false">http://www.blogspan.net/presse/dusen-schlick-technologies-is-exhibiting-at-the-achema-2009/mitteilung/65418/</guid>
		<description><![CDATA[(pressebox) Untersiemau/Coburg, 28.04.2009, Düsen-Schlick is one of the worldwide leading nozzle manufacturers, offering the entire range of services relating to the use of nozzles starting from research and development through to production and service, all from one source. Providing solutions without delay. Trend-setting patents, such as ABC-Technology®, ensure the company&#8217;s production success in the areas [...]]]></description>
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		<title>Agilent Technologies to Collaborate with ASTER for Seamless Test Coverage Analysis across Test Platforms</title>
		<link>http://www.blogspan.net/presse/agilent-technologies-to-collaborate-with-aster-for-seamless-test-coverage-analysis-across-test-platforms/mitteilung/49214/</link>
		<comments>http://www.blogspan.net/presse/agilent-technologies-to-collaborate-with-aster-for-seamless-test-coverage-analysis-across-test-platforms/mitteilung/49214/#comments</comments>
		<pubDate>Wed, 18 Mar 2009 14:16:06 +0000</pubDate>
		<dc:creator>News Online</dc:creator>
				<category><![CDATA[Allgemeine Mitteilungen]]></category>
		<category><![CDATA[Agilent Technologies]]></category>
		<category><![CDATA[Agilent Technologies Inc]]></category>
		<category><![CDATA[Button Test]]></category>
		<category><![CDATA[Circuit Board Assembly]]></category>
		<category><![CDATA[Coverage Analysis Tool]]></category>
		<category><![CDATA[Coverage Comparisons]]></category>
		<category><![CDATA[Coverage Estimation]]></category>
		<category><![CDATA[Coverage Measurement]]></category>
		<category><![CDATA[Fault Coverage]]></category>
		<category><![CDATA[Measurement Systems]]></category>
		<category><![CDATA[Printed Circuit Board]]></category>
		<category><![CDATA[Printed Circuit Board Assembly]]></category>
		<category><![CDATA[Program Tools]]></category>
		<category><![CDATA[Scan Tester]]></category>
		<category><![CDATA[Test Coverage Analysis]]></category>
		<category><![CDATA[Test Platforms]]></category>
		<category><![CDATA[Test Program Development]]></category>
		<category><![CDATA[Theoretical Coverage]]></category>
		<category><![CDATA[This Allows Users]]></category>
		<category><![CDATA[X Ray Inspection]]></category>

		<guid isPermaLink="false">http://www.blogspan.net/presse/agilent-technologies-to-collaborate-with-aster-for-seamless-test-coverage-analysis-across-test-platforms/mitteilung/49214/</guid>
		<description><![CDATA[(pressebox) Santa Clara, Calif., 18.03.2009, Agilent Technologies Inc. (NYSE: A) today announced its strategic partnership with ASTER to enable integration of ASTER&#8217;s &#34;TestWay Coverage Analyst (TCA)&#34; across Agilent&#8217;s printed circuit board assembly test platforms. The TestWay Coverage Analyst provides a push button test coverage analysis tool for coverage estimation (pre-test program development) and coverage measurement [...]]]></description>
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		<slash:comments>0</slash:comments>
		</item>
		<item>
		<title>Free Keithley Web-Based Seminar Explores Fundamentals of Hall Effect Measurements</title>
		<link>http://www.blogspan.net/presse/free-keithley-web-based-seminar-explores-fundamentals-of-hall-effect-measurements/mitteilung/34447/</link>
		<comments>http://www.blogspan.net/presse/free-keithley-web-based-seminar-explores-fundamentals-of-hall-effect-measurements/mitteilung/34447/#comments</comments>
		<pubDate>Thu, 12 Feb 2009 15:31:18 +0000</pubDate>
		<dc:creator>News Online</dc:creator>
				<category><![CDATA[Allgemeine Mitteilungen]]></category>
		<category><![CDATA[American Audience]]></category>
		<category><![CDATA[Carrier Concentration]]></category>
		<category><![CDATA[Carrier Mobility]]></category>
		<category><![CDATA[Central European Time]]></category>
		<category><![CDATA[Characterization Lab]]></category>
		<category><![CDATA[Compound Semiconductor Materials]]></category>
		<category><![CDATA[Conductivity Type]]></category>
		<category><![CDATA[Cornell University]]></category>
		<category><![CDATA[Device Characterization]]></category>
		<category><![CDATA[Electrical Test Instruments]]></category>
		<category><![CDATA[Equipment Considerations]]></category>
		<category><![CDATA[Hall Effect Measurements]]></category>
		<category><![CDATA[Keithley Instruments Inc]]></category>
		<category><![CDATA[Materials Scientists]]></category>
		<category><![CDATA[Measurement Systems]]></category>
		<category><![CDATA[Patent Registration]]></category>
		<category><![CDATA[Photovoltaic Applications]]></category>
		<category><![CDATA[Refereed Journal Articles]]></category>
		<category><![CDATA[Semiconductor Industry]]></category>
		<category><![CDATA[Seminar Participants]]></category>

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		<description><![CDATA[(pressebox) Cleveland, Ohio, 12.02.2009, Keithley Instruments, Inc. (NYSE:KEI), a world leader in advanced electrical test instruments and systems, will broadcast a free, web-based seminar titled &#34;Hall Effect Measurements Fundamentals&#34; on Thursday, February 19, 2009. This one-hour seminar will introduce the topic of Hall Effect measurements as they relate to semiconductor materials and device characterization. To [...]]]></description>
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		<item>
		<title>Group Introduces New Suite of Aligners and Measurement Systems for 3D IC and Other Advanced Semiconductor, MEMS and Nanotechnology Device Manufacturing</title>
		<link>http://www.blogspan.net/presse/group-introduces-new-suite-of-aligners-and-measurement-systems-for-3d-ic-and-other-advanced-semiconductor-mems-and-nanotechnology-device-manufacturing/mitteilung/12755/</link>
		<comments>http://www.blogspan.net/presse/group-introduces-new-suite-of-aligners-and-measurement-systems-for-3d-ic-and-other-advanced-semiconductor-mems-and-nanotechnology-device-manufacturing/mitteilung/12755/#comments</comments>
		<pubDate>Tue, 02 Dec 2008 10:25:23 +0000</pubDate>
		<dc:creator>News Online</dc:creator>
				<category><![CDATA[Allgemeine Mitteilungen]]></category>
		<category><![CDATA[Acceptance Tests]]></category>
		<category><![CDATA[Advanced Semiconductor]]></category>
		<category><![CDATA[Alignment Accuracy]]></category>
		<category><![CDATA[Alignment Inaccuracies]]></category>
		<category><![CDATA[Compound Semiconductor]]></category>
		<category><![CDATA[Device Failure]]></category>
		<category><![CDATA[Device Performance]]></category>
		<category><![CDATA[Lithography Equipment]]></category>
		<category><![CDATA[Mask Aligners]]></category>
		<category><![CDATA[Measurement Accuracy]]></category>
		<category><![CDATA[Measurement Systems]]></category>
		<category><![CDATA[Mems]]></category>
		<category><![CDATA[Paul Lindner]]></category>
		<category><![CDATA[Precision Alignment]]></category>
		<category><![CDATA[Semiconductor Markets]]></category>
		<category><![CDATA[Semiconductor Silicon]]></category>
		<category><![CDATA[St Florian]]></category>
		<category><![CDATA[Substrate Materials]]></category>
		<category><![CDATA[Technology Director]]></category>
		<category><![CDATA[Wafer Bonding]]></category>

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		<description><![CDATA[The &#8216;NT&#8217; Series Significantly Increases Both Alignment and Measurement Accuracy to Enable Better Device Performance and Lower Manufacturing Costs (pressebox) St. Florian/Inn, 02.12.2008 &#8211; EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the NT series &#8212; a new, yet already field-proven suite [...]]]></description>
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