PRESSEMITTEILUNGEN

(pressebox) Dresden, 30.04.2009, KSW Microtec AG, one of the world¹s leading suppliers of RFID components and inlays for secure cards, documents and other form factors, will be highlighting its range of HF and UHF polycarbonate inlays for security-critical applications in the government and enterprise ID sectors at CTST 2009 in New Orleans, from May 4 to 7.

Government applications and identification in general are fast growing markets for KSW Microtec and the company is seeing even greater future potential in this sector. Its leading edge technology and capacity for innovation has brought to market ultra thin HF and UHF pre-laminates, which are specially suited to government and security applications. As a result the polycarbonate inlay for MIFARE family cards are increasingly seen in the production of ID cards. Unlike a traditional PET inlay, this new product is easily laminated into a polycarbonate card, ensuring a matching material connection.

As with other KSW inlays, the UHF polycarbonate transponder can be produced in roll or sheet format, including customized sheet layouts. KSW incorporates antennae printing, chip processing (including patented Pd- bumping process) and assembly, bringing significant cost-saving benefits to customers.

In addition, KSW Microtec¹s Thinlam® inlay, with a thickness down to 280µm, will also be on display and customers at CTST will be able to view this product for example with Inside Micropass L4. Thinlam® and Dual Interface Thinlam® are both setting new standards for card manufacturing. It enables manufacturers to produce HF and UHF RFID cards with more layers, broadening the possibilities to integrate more security and other high value features into cards.

Thinlam® maintains high durability because of its unique patented chip connection technology. In addition, the KSW Thinlam® achieves low tolerances of the resonance frequency. Thinlam® can be manufactured on PVC, Polycarbonate, PET or Teslin® and can also be used for transparent RFID cards due to its excellent optical characteristics.

KSW Microtec looks forward to meeting its customers and partners at the show and having the opportunity to introduce its new generation of prelaminates.

Visit KSW Microtec at CTST 2009, at the Hilton New Orleans Riverside on booth: 215 – 217Über KSW Microtec AG

KSW Microtec AG, with its headquarters in Germany, is the world¹s leading supplier of RFID (Radio Frequency Identification) components for applications such as eTicketing, ePayment, Asset Management, access control and high security. KSW combines successful high-end wafer processing, extremely efficient assembly technology and far-reaching expertise in design. KSW has earned itself a leading position on the market as one of the most efficient, and simultaneously most flexible, producers of RFID components. The globally active company was founded in 1994 and has clean room production facilities in Germany. KSW is an investment holding of the listed venture capital company Deutsche Effecten- und Wechsel-Beteiligungsgesellschaft AG headquartered in Jena. For more information see: www.ksw-microtec.de

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Antennae, Chip Connection, Connection Technology, Critical Applications, Ctst, Dual Interface, Form Factors, Government Applications, Inlay, Inlays, Laminates, Leading Edge Technology, Material Connection, Microtec, Polycarbonate, Resonance Frequency, Rfid Components, Security Applications, Teslin, Value Features