PRESSEMITTEILUNGEN

(pressebox) Austin , Texas, 11.09.2009,

Freescale Semiconductor’s MSC8156 multicore digital signal processor (DSP) has won the prestigious 2009 InfoVision Award in the category of "Enabling Silicon and Component-Level Technologies."

Presented earlier this week at the Broadband World Forum Europe 2009 event by the International Engineering Consortium (IEC), the award recognizes advances in technologies, applications, products and services judged to be the most beneficial to the information communication technology industry.

Freescale’s MSC8156 DSP is designed to speed adoption of next-generation wireless standards. The highly integrated device combines multi-standard baseband accelerators and six 1GHz cores based on Freescale’s enhanced SC3850 StarCore® DSP core technology, providing OEMs with six gigahertz performance, outstanding energy efficiency and form factor advantages.

"We are honored by the IEC’s recognition of Freescale’s MSC8156 DSP as a winner of its esteemed InfoVision award," said Scott Aylor, general manager of DSP Products for Freescale’s Networking & Multimedia Group. "This award further validates the MSC8156 as an industry changing device that is opening the door to new levels of broadband services."

Freescale’s MSC8156 device delivers the flexibility, integration and affordability required to power highly advanced base stations supporting next-generation wireless standards. The company is experiencing strong market traction with the MSC8156 DSP in multiple regions, and several leading OEMs have selected the DSP for their newest base station offerings.

The IEC is the foremost engineering society dedicated to advancing the electronics industry by facilitating partnership between industry and academia for continuing education, research and service programs.

"The IEC’s InfoVision Awards give tribute to the top broadband technologies in deployment today," said IEC president John Janowiak. "We’re pleased to recognize Freescale Semiconductor as a winner for its MSC8156 DSP in the category of Enabling Silicon and Component-Level Technologies."
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