PRESSEMITTEILUNGEN

(pressebox) Essen, 07.10.2009,

Today Evonik Industries AG issued a ? 750 million bond.The 5 year bond pays a coupon of 7.000 % p.a. It was issued at a price of 99.489 % resulting in a yield of 7.125 % p.a. The bond was seven times oversubscribed on the back of high demand from private and institutional investors.

“The strong interest in this transaction underpins the capital market’s trust in our group,” commented Dr. Klaus Engel, Chairman of the Executive Board of Evonik Industries AG. “This bond issue is a further successful step of Evonik in the capital market.”

Prior to the bond issue, Evonik Industries AG, represented by CFO Dr. Wolfgang Colberg, conducted a four-day pan-European roadshow to introduce the group to investors in London, Paris, Amsterdam, Frankfurt, Munich, and Dusseldorf.

The bond issue is an important addition to the group’s financing strategy. “This transaction places our funding structure on an even sounder basis. It also smoothens out the maturity profile of our liabilities,” said Dr. Colberg.

Joint Lead Managers and Bookrunners are Deutsche Bank, HSBC, The Royal Bank of Scotland and the UniCredit Group. Co-Leads are Commerzbank, DZ Bank and WestLB.
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