Yoqneam, Israel (ots) – CoreFlow Ltd., a leading provider of flotation solutions for precision manufacturing environments, announced today that its Wafer Singulation system SingFlow has successfully passed a number of tests at customer manufacturing sites and internal demonstrations and is ready to be shipped to customers. SingFlow is the first automatic system that successfully deals with the delicate separation of wafers that eliminates manual labor and thus solves one of the critical steps in the crystalline PV manufacturing process.
SingFlow singulation system is based on a unique, stress-free, pure-shear singulation concept. This patent-pending technology delivers the first field-proven fully automated production system, and improves production efficiency, throughput and yield of the manufacturing process. The modular system design supports the output to different configurations of lane-based cleaning systems, supporting 5-6 lanes, or cassette loading for batch cleaning. System throughput with a 2-head singulation configuration is 3,000 WPH.
SingFlow features stress-free wafer singulation with a unique control that ensures minimal contact force on the wafer. Minimal wafer manipulations, the integration of customer-specific carrier (used in the glue-dissolving process) into the SingFlow system, as well as direct loading to clean lane or cassette enables a fully automated singulation process. The singulation process is fully controlled with automatic compensation for wafer thickness variation, automatic detection and sorting of broken wafers and submerged operation in filtered water.
Contact:
Eric Joely, VP Sales and Marketing
M: 972-52-399-2168
E: eric_j@coreflow.com
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